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PCB Assembly - SMT / SMT + Thru-hole
Sensonix offers the latest technologies and processes along with our world-class manufacturing system to provide you with PCB assembly and test. By leveraging demand flow methodology and Kan Ban systems we deliver products efficiently and cost effectively. From our fine pitch BGA, CSP and QFP placement capabilities to 0402 component and flip chip placement, Sensonix' manufacturing line is world class. Depending on the technology mix, thru-hole components can be assembled with wave soldering, solder robot assembly or paste-in-hole technology.


Wire Bond & Mixed (chip-on-board + SMT) Assembly
Sensonix offers chip-on-board manufacturing processes on a wide range of laminate and ceramic substrates. These processes can accommodate a flexible component mix including bare die, fine pitch wire-bonded die, conventional surface mount components and flip chips/wafer level CSP as well as several encapsulation options. Sensonix has experience with mixed assembly and wire bonding on RF Teflon based materials such as RogersTM, ArlonTM and TaconicTM.


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Flexible Pick & Place Assembly Lines
Flexible Pick & Place Assembly Lines

Custom Wafer level CSP
Custom Wafer level CSP

Automated Wire Bonder
Automated Wire Bonder

Fine Pitch Wire Bonding
Fine Pitch Wire Bonding

Module Encapsulation
Module Encapsulation

Call Sensonix (763) 519-7042