Sensonix, Inc. Return to Sensonix Home Page
Manufacturing Non-Electronic Product Assembly Supply Chain Management Prototype Manufacturing Capability and Design for Manufacture Advanced Packaging PCB Assembly MAnufacturing
Call Sensonix (763) 519-7042
  Prototype Capability and Design for Manufacture

Prototype capability
Sensonix manufacturing team has strong process and design engineering capability. Consequently we are very comfortable with early stage prototype builds that lack complete documentation or even processes that have not been fully developed - as realists, we know that most projects start this way. This is particularly important with advanced technology jobs that include wire bonding, advanced (ex -Teflon filled) laminate substrates and/or fine pitch chip scale packages. We will work side by side with your engineers to get past the hurdles that often crop up at this phase of the project and develop a high yielding, manufacturable process.

Design for manufacture
Sensonix has multiple manufacturing lines that cater to small lots and frequent changeover. These lines use the same state of the art equipment as our volume production lines. This means that your first articles will be representative of the subsequent volume build and will transition seamlessly to production on one of our higher volume lines. We accomplish this by panelizing your boards to fit on one of several standard substrate sizes so that changeover from product to product happens with minimal time and cost impact. We can provide standard panel drawings, fiducials and tooling information to assist your substrate vendor in manufacturing to our guidelines. Alternatively, we can work directly with your substrate vendor to facilitate panelization and generate the corresponding stencil artwork.

ManufacturingDesign/TechnologiesTestingQualityContact Us
Copyright © 2003 Sensonix Incorporated.  All rights reserved.