Advanced die SIP COB CSP multi-chip packaging manufacturing

MCM-L

System in a Package

With new packaging technologies being developed as quickly as products are introduced, EMS providers need to rapidly adopt these technologies. Sensonix' capabilities in this area are highlighted by system in a package (SIP) technology. By placing wire-bond die, flip chip and or SMT components in the same package, SIP provides system-level integration that yields flexibility, cost savings, and the opportunity to bring products out to market faster than conventional system on a chip (SOC) methodologies.

Sensonix offers advanced packaging options that utilize bare or bumped die, bringing the overall package into a smaller, more cost effective form factor. Our manufacturing lines build chip-on-board (COB) and multi-chip modules that incorporate silicon, polyamide, BCB, FR4, flex and ceramic substrates. Other packaging technologies offered are, wafer level CSP, multi-chip packages and die-stacking technologies.

Sensonix also has advanced packaging capabilities for RF and wireless products. Our ability to utilize advanced laminates including Rogers, Arlon and Taconic together with advanced wire-bonding techniques gives Sensonix the unique capability to manufacture a wide variety of RF and wireless applications customized to your specifications.

Sensonix also provides custom packaging services for your form factor requirement. With our knowledge, technology, and manufacturing lines, Sensonix incorporates your packaging ideas into production. If you have an idea for a custom package, share it with us for implementation.