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System in a Package

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System in a Package 2

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IC Design

Advanced Packaging & Multi Chip Module Design
Our technology group has the capability to quickly miniaturize your design using a wide range of advanced packaging techniques. In these advanced packages, any combination of bare die, bumped die and discrete surface mount components are interconnected with a high performance substrate design, redistributed to solder bumps, leads or landings, and encapsulated if desired. This approach allows more flexibility, quicker time to market and often an equivalent integration density when compared with a system on a chip approach. This is because each function is implemented in the most appropriate process technology. Our designers can even extend these packaging techniques for RF applications by using advanced laminate substrates such as RogersTM, TaconicTM or ArlonTM in the multi-chip module.

Depending on your technology mix, an advanced system in a package approach as an alternative to a mixed signal ASIC or system on a chip may be just the solution for your needs.

Design, Substrate and Technology Options for Advanced Packaging

  • SIP/ System in a package
  • Laminate multi-chip module (MCM-L)
  • Ceramic multi-chip module (MCM-C)
  • Wafer level CSP
  • Die Stacking technologies
  • FR4
  • Flex
  • Rigid Flex
  • RogersTM
  • TaconicTM
  • ArlonTM
  • LTCC

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